Figure 8: Approaching zero (schematic diagram of ÒcrackingÓ)
(A) Schematic diagram of the cracking process depicting fracture of a single-crystalline silicon wafer with an epoxy-bonded glass backlayer. (B) Schematic diagram of the process of replication: (i) coating the crack with a PDMS composite and curing; (ii) removing and triming the resultant PDMS stamp; (iii) spin-coating PU onto the PDMS stamp; (iv) curing and peeling off the PU replica.