Publications

1996
K. E. Schwiebert, D. N. Chin, J.C. MacDonald, and G. M. Whitesides. 1996. “Engineering the Solid State with 2-Benzimidazolones.” J. Am. Chem., 118, Pp. 4018-4029. PDF
484
J. Gao, M. Mammen, and G. M. Whitesides. 1996. “Evaluating Electrostatic Contributions to Binding with the Use of Protein Charge Ladders.” Science, 272, Pp. 535-537. PDF
492
E. Kim, G. M. Whitesides, L. K. Lee, S. P. Smith, and M. G. Prentiss. 1996. “Fabrication of Arrays of Channel Waveguides by Three-Dimensional Self-Assembly Using Patterned Organic Monolayers as Templates.” Adv. Mat., 8, Pp. 139-142. PDF
479
E. Kim, G. M. Whitesides, M. B. Freiler, M. Levy, J. L. Lin, and R. M. Osgood. 1996. “Fabrication of Micrometer-Scale Structures on GaAs and GaAs/AlGaAs Quantum Well Material Using Microcontact Printing.” Nanotechnology, 7, Pp. 266-269. PDF
518
X-M. Zhao, A. Stoddart, S. P. Smith, E. Kim, Y. Xia, M. G. Prentiss, and G. M. Whitesides. 1996. “Fabrication of Single-Mode Polymeric Waveguides Using Micromolding in Capillaries.” Advanced Materials, 8, Pp. 420-424. PDF
500
X-M. Zhao, Y. Xia, and G. M. Whitesides. 1996. “Fabrication of Three-Dimensional Micro-Structures: Microtransfer Molding.” Advanced Materials, 8, Pp. 837-840. PDF
477
D. M. Cyr, B. Venkataraman, G. W. Flynn, A. J. Black, and G. M. Whitesides. 1996. “Functional Group Identification in Scanning Tunneling Microscopy of Molecular Adsorbates.” J. Phys. Chem., 100, Pp. 13747-13759. PDF
509
Y. Xia, E. Kim, M. Mrksich, and G. M. Whitesides. 1996. “Microcontact Printing of Alkanethiols on Copper and Its Application in Microfabrication.” Chem. Mat., 8, Pp. 601-603. PDF
475
Y. Xia, E. Kim, and G. M. Whitesides. 1996. “Microcontact Printing of Alkanethiols on Silver and Its Application in Microfabrication.” J. Electrochem. Soc., 143, Pp. 1070-1079. PDF
507
P. C. Hidber, W. Helbig, E. Kim, and G. M. Whitesides. 1996. “Microcontact Printing of Palladium Colloids: Micron-Scale Patterning by Electroless Deposition of Copper.” Langmuir, 12, Pp. 1375-1380. PDF
486
J.L. Wilbur, A. Kumar, H. A. Biebuyck, E. Kim, and G. M. Whitesides. 1996. “Microcontact Printing of Self-Assembled Monolayers: Applications in Microfabrication.” Nanotechnology, 7, Pp. 452-457. PDF
515
Y. Xia, D. Qin, and G. M. Whitesides. 1996. “Microcontact Printing with a Cylindrical Rolling Stamp: A Practical Step Toward Automatic Manufacturing of Patterns with Submicrometer-Sized Features.” Advanced Materials, 8, Pp. 1015-1017. PDF
520
E. Kim, Y. Xia, and G. M. Whitesides. 1996. “Micromolding in Capillaries: Applications in Materials Science.” J. Am. Chem. Soc., 118, Pp. 5722-5731. PDF
502
Y. Xia, E. Kim, and G. M. Whitesides. 1996. “Micromolding of Polymers in Capillaries: Applications in Microfabrication.” Chem. Mat., 8, Pp. 1558-1567. PDF
501
C. S. Weisbecker, M. V. Merritt, and G. M. Whitesides. 1996. “Molecular Self-Assembly of Aliphatic Thiols on Gold Colloids.” Langmuir, 12, Pp. 3763-3772. PDF
508
S.-K. Choi, M. Mammen, and G. M. Whitesides. 1996. “Monomeric Inhibitors of Influenza Neuraminidase Enhance the Hemagglutination Inhibition Activities of Polyacrylamides Presenting Multiple C-Sialoside Groups.” Chemistry and Biology, 3, Pp. 97-104. PDF
494
P. C. Hidber, P. F. Nealey, W. Helbig, and G. M. Whitesides. 1996. “A New Strategy for Controlling the Size and Shape of Metallic Features Formed by Electroless Deposition of Copper: Microcontact Printing of Catalysts on Oriented Polymers, Followed by Thermal Shrinkage.” Langmuir, 12, Pp. 5209-5215. PDF
513
Y. Xia, J. Tien, D. Qin, and G. M. Whitesides. 1996. “Non-Photolithographic Methods for Fabrication of Elastomeric Stamps for Use in Microcontact Printing.” Langmuir, 12, Pp. 4033-4038. PDF
514
M. Mammen, K. Helmerson, R. Kishore, S.-K. Choi, W. D. Phillips, and G. M. Whitesides. 1996. “Optically Controlled Collisions of Biological Objects to Evaluate Potent Polyvalent Inhibitors of Virus-Cell Adhesion.” Chemistry and Biology, 3, Pp. 757-763. PDF
497
Y. Xia, X-M. Zhao, and G. M. Whitesides. 1996. “Pattern Transfer: Self-Assembled Monolayers as Ultrathin Resists.” Microelec. Eng., 32, Pp. 255-268. PDF
498

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